AD7887ARM datasheet(6/24 Pages) AD

6 / 24 page

AD7887

Rev. D | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VDD to AGND

−0.3 V to +7 V

Analog Input Voltage to AGND

−0.3 V to VDD + 0.3 V

Digital Input Voltage to AGND

−0.3 V to VDD + 0.3 V

Digital Output Voltage to AGND

−0.3 V to VDD + 0.3 V

REFIN/REFOUT to AGND

−0.3 V to VDD + 0.3 V

Input Current to Any Pin Except Supplies1

±10 mA

Operating Temperature Range

Commercial Temperature Range

A, B Versions

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

+150°C

SOIC or MSOP Package Power Dissipation

450 mW

θJA Thermal Impedance

157°C/W (SOIC)

205.9°C/W (MSOP)

θJC Thermal Impedance

56°C/W (SOIC)

43.74°C/W (MSOP)

Lead Temperature, Soldering

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

Pb-Free Temperature, Soldering Reflow

260(0)°C

ESD

4 kV

1 Transient currents of up to 100 mA do not cause SCR latch-up.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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