MPC8306S datasheet(44/70 Pages) FREESCALE

部品番号	MPC8306S

部品情報	PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications

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メーカー	FREESCALE [Freescale Semiconductor, Inc]

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MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1

Freescale Semiconductor

Package and Pin Listings

19 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8306S is available in

a thermally enhanced MAPBGA (mold array process-ball grid array); see Section 19.1, “Package

Parameters for the MPC8306S,” and Section 19.2, “Mechanical Dimensions of the MPC8306S

MAPBGA,” for information on the MAPBGA.

19.1

Package Parameters for the MPC8306S

The package parameters are as provided in the following list.

Package outline

19 mm

19 mm

Package Type

MAPBGA

Interconnects

369

Pitch

0.80 mm

Module height (typical)

1.48 mm; Min = 1.31mm and Max 1.61mm

Solder Balls

96 Sn / 3.5 Ag / 0.5 Cu (VM package)

Ball diameter (typical)

0.40 mm

19.2

Mechanical Dimensions of the MPC8306S MAPBGA

The following figure shows the mechanical dimensions and bottom surface nomenclature of the

MPC8306S, 369-MAPBGA package.

MPC8306S データシート(PDF) 44 Page - Freescale Semiconductor, Inc