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STMPE1801 データシート(PDF) 54 Page - STMicroelectronics |
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STMPE1801 データシート(HTML) 54 Page - STMicroelectronics |
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54 / 60 page ![]() Package mechanical data STMPE1801 54/60 Doc ID 17884 Rev 3 13 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 10. Package outline for Flip-chip CSP 25 (2.03 x 2.03 mm) - 0.4 mm pitch |
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