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ST7MC1 データシート(PDF) 284 Page - STMicroelectronics |
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ST7MC1 データシート(HTML) 284 Page - STMicroelectronics |
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284 / 308 page ![]() ST7MC1/ST7MC2 284/308 13 PACKAGE CHARACTERISTICS In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level in- terconnect. The category of second Level Inter- connect is marked on the package and on the in- ner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to solder- ing conditions are also marked on the inner box la- bel. ECOPACK is an ST trademark. ECOPACK speci- fications are available at: www.st.com. 13.1 PACKAGE MECHANICAL DATA Figure 162. 80-Pin Low Profile Quad Flat Package Dim. mm inches Min Typ Max Min Typ Max A 1.60 0.063 A1 0.05 0.15 0.002 0.006 A2 1.35 1.40 1.45 0.053 0.055 0.057 b 0.22 0.32 0.38 0.009 0.013 0.015 C 0.09 0.20 0.004 0.008 D 16.00 0.630 D1 14.00 0.551 E 16.00 0.630 E1 14.00 0.551 e 0.65 0.026 θ 0° 3.5° 7° 0° 3.5° 7° L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.00 0.039 Number of Pins N 80 A A2 A1 b e h c L L1 E E1 D1 D |
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