RN4870 datasheet(17/48 Pages) MICROCHIP

部品番号	RN4870

部品情報	Bluetooth 4.2 Low Energy Module

PDF	48 Pages

Scroll/Zoom	100%

メーカー	MICROCHIP [Microchip Technology]

ホームページ	http://www.microchip.com

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 2016 Microchip Technology Inc.

DS50002489A-page 17

RN4870/71

4.3

RN4871 Module

Figure 4-7 shows the physical dimensions of the

RN4871 module. Figure 4-8 illustrates the recom-

mended PCB layout, and Figure 4-9 shows the recom-

mended mounting details.

Ensure that there is no top copper layer near the test

pin area, indicated by the shaded keep out areas, as

shown in Figure 4-8. When laying out the host PCB, the

areas under the antenna must not contain any top,

inner layer, or bottom copper as shown in Figure 4-9. A

low-impedance ground plane ensures the best radio

performance (best range; lowest noise). Figure 4-9

also shows a space area around antenna section for

best antenna performance. The ground plane can be

extended beyond the minimum recommended as

required for host PCB EMC noise reduction. For best

range performance, keep all external metal at least

30 mm away from the ceramic chip antenna.

FIGURE 4-7:

RN4871 MODULE DIMENSIONS

RN4870 データシート(PDF) 17 Page - Microchip Technology