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LF356-MIL データシート(PDF) 3 Page - Texas Instruments

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部品番号 LF356-MIL
部品情報  JFET Input Operational Amplifier
PDF  28 Pages
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

LF356-MIL データシート(HTML) 3 Page - Texas Instruments

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LF356-MIL
www.ti.com
SNOSD55 – JUNE 2017
Product Folder Links: LF356-MIL
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
5 Pin Configuration and Functions
LMC Package
8-Pin TO-99
Top View
Available per JM38510/11401 or
JM38510/11402
D or P Package
8-Pin SOIC or PDIP
Top View
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
BALANCE
1, 5
I
Balance for input offset voltage
+INPUT
3
I
Noninverting input
–INPUT
2
I
Inverting input
NC
8
No connection
OUTPUT
6
O
Output
V+
7
Positive power supply
V–
4
Negative power supply
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The maximum power dissipation for these devices must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the
ambient temperature, TA. The maximum available power dissipation at any temperature is PD = (TJMAX − TA) / θJA or the 25°C PdMAX,
whichever is less.
(3)
If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.
(4)
Unless otherwise specified the absolute maximum negative input voltage is equal to the negative power supply voltage.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
Supply voltage
±18
V
Differential input voltage
±30
V
Input voltage(4)
±16
V
Output short circuit duration
Continuous
TJMAX
LMC package
115
°C
P package
100
D package
100
Soldering
information
(lead temp.)
TO-99 package
Soldering (10 sec.)
300
°C
PDIP package
Soldering (10 sec.)
260
SOIC package
Vapor phase (60 sec.)
215
Infrared (15 sec.)
220
Storage temperature, Tstg
−65
150
°C



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