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LF356-MIL

SNOSD55 – JUNE 2017

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(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

100 pF discharged through 1.5-kΩ resistor

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

±15

V

0

70

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

LF356-MIL

UNIT

D (SOIC)

P (PDIP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

112.5

55.2

°C/W

Junction-to-case (top) thermal resistance

58.8

44.5

°C/W

Junction-to-board thermal resistance

52.8

32.4

°C/W

Junction-to-top characterization parameter

12.8

21.7

°C/W

Junction-to-board characterization parameter

52.3

32.3

°C/W

(1)

Settling time is defined here, for a unity gain inverter connection using 2-kΩ resistors for the LF15x. It is the time required for the error

voltage (the voltage at the inverting input pin on the amplifier) to settle to within 0.01% of its final value from the time a 10-V step input is

Settling Time Test Circuit).

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SR

Slew Rate

12

V/μs

GBW

Gain Bandwidth

Product

5

MHz

Settling Time to

1.5

μs

Equivalent Input

Noise Voltage

f = 100 Hz

15

nV/

√Hz

f = 1000 Hz

12

nV/

√Hz

Equivalent Input

Current Noise

f = 100 Hz

0.01

pA/

√Hz

f = 1000 Hz

0.01

pA/

√Hz

Input

Capacitance

3

pF

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Supply current

5

10

mA