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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LF356-MIL

SNOSD55 – JUNE 2017

LF356-MIL JFET Input Operational Amplifier

1

1 Features

1

•

Advantages

–

Replace Expensive Hybrid and Module FET

Op Amps

–

Rugged JFETs Allow Blow-Out Free Handling

Compared With MOSFET Input Devices

–

Excellent for Low Noise Applications Using

Either High or Low Source Impedance—Very

Low 1/f Corner

–

Offset Adjust Does Not Degrade Drift or

Common-Mode Rejection as in Most

Monolithic Amplifiers

–

New Output Stage Allows Use of Large

Capacitive Loads (5,000 pF) Without Stability

Problems

–

Internal Compensation and Large Differential

Input Voltage Capability

•

Common Features

–

Low Input Bias Current: 30 pA

–

Low Input Offset Current: 3 pA

–

–

Low Input Noise Current: 0.01 pA/

√Hz

–

High Common-Mode Rejection Ratio: 100 dB

–

Large DC Voltage Gain: 106 dB

•

Uncommon Features

–

Extremely Fast Settling Time to 0.01%: 1.5 μs

–

Fast Slew Rate: 12 V/µs

–

Wide Gain Bandwidth: 5 MHz

–

Low Input Noise Voltage: 12 nV/

√Hz

2 Applications

•

Precision High-Speed Integrators

•

Fast D/A and A/D Converters

•

High Impedance Buffers

•

Wideband, Low Noise, Low Drift Amplifiers

•

Logarithmic Amplifiers

•

Photocell Amplifiers

•

Sample and Hold Circuits

3 Description

The LF356-MIL device are the first monolithic JFET

input

operational

amplifiers

to

incorporate

well-

matched, high-voltage JFETs on the same chip with

standard bipolar transistors (BI-FET™ Technology).

These amplifiers feature low input bias and offset

currents/low offset voltage and offset voltage drift,

coupled with offset adjust, which does not degrade

drift or common-mode rejection. The devices are also

designed

for

high

slew

rate,

wide

bandwidth,

extremely fast settling time, low voltage and current

noise and a low 1/f noise corner.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

LF356-MIL

SOIC (8)

4.90 mm × 3.91 mm

TO-CAN (8)

9.08 mm × 9.08 mm

PDIP (8)

9.81 mm × 6.35 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Simplified Schematic

3 pF in LF357 series