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GD25LE256DWJS データシート(PDF) 43 Page - GigaDevice Semiconductor (Beijing) Inc.

部品番号 GD25LE256DWJS
部品情報  1.8V Uniform Sector Dual and Quad Serial Flash
PDF  83 Pages
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メーカー  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
ホームページ  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD25LE256DWJS データシート(HTML) 43 Page - GigaDevice Semiconductor (Beijing) Inc.

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1.8V Uniform Sector
Dual and Quad Serial Flash
GD25LE256D
43
7.21. Chip Erase (CE) (60/C7H)
The Chip Erase (CE) command is erased the all data of the chip. A Write Enable (WREN) command must previously
have been executed to set the Write Enable Latch (WEL) bit .The Chip Erase (CE) command is entered by driving CS# Low,
followed by the command code on Serial Data Input (SI). CS# must be driven Low for the entire duration of the sequence.
The Chip Erase command sequence: CS# goes low  sending Chip Erase command  CS# goes high. The
command sequence is shown in Figure22. CS# must be driven high after the eighth bit of the command code has been
latched in; otherwise the Chip Erase command is not executed. As soon as CS# is driven high, the self-timed Chip Erase
cycle (whose duration is tCE) is initiated. While the Chip Erase cycle is in progress, the Status Register may be read to check
the value of the Write in Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Chip Erase cycle, and
is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset.
The Chip Erase (CE) command is executed if the Block Protect (BP2, BP1, and BP0) bits are 0 and CMP=0 or the Block
Protect (BP2, BP1, and BP0) bits are 1 and CMP=1. The Chip Erase (CE) command is ignored if one or more sectors are
protected.
Figure22. Chip Erase Sequence Diagram
Command
0
1
2
3
4
5
6
7
60H or C7H
CS#
SCLK
SI
Figure22a. Chip Erase Sequence Diagram (QPI)
CS#
SCLK
IO0
IO1
IO2
IO3
0
1
Instruction
C7H/60H



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