ADF41513 datasheet(6/30 Pages) AD

6 / 30 page

ADF41513

Data Sheet

Rev. 0 | Page 6 of 30

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

AVDDx to GND1

−0.3 V to +3.6 V

VP to GND

−0.3 V to +3.6 V

VP to AVDDx

−0.3 V to +0.3 V

Digital Input/Output Voltage to GND

−0.3 V to AVDDx + 0.3 V

Analog Input/Output Voltage to GND

−0.3 V to VP + 0.3 V

RFINA, RFINB to GND

−0.3 V to +3.6 V

RFINA to RFINB1

±1.4 V

REFIN to GND

−0.3 V to +2.1 V

Operating Temperature Range

Industrial

−40°C to +105°C

Storage Temperature Range

−65°C to +125°C

Maximum Junction Temperature

Operational

125°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

40 sec

Electrostatic Discharge (ESD)

Charged Device Model

1250 V

Human Body Model

1500 V

Transistor Count

CMOS

215,726

Bipolar

1625

Approximately 13 dBm into a 50 Ω input.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

This device is a high performance RF IC with an electrostatic

discharge (ESD) rating of <2 kV, and the device is ESD sensitive.

Take proper precautions for handling and assembly.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-24-81

°C/W

The thermal resistance values are defined per the JESD51 standard.

ESD CAUTION

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