AD9546SLASHPCBZ datasheet(38/205 Pages) AD

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AD9546

Data Sheet

Rev. 0 | Page 38 of 205

ABSOLUTE MAXIMUM RATINGS

Table 39.

Parameter

Rating

1.8 V Supply Voltage (VDD)

2 V

Output Drivers (OUT0AP, OUT0AN,

OUT0BP, OUT0BN, OUT0CP,

OUT0CN, OUT1AP, OUT1AN,

OUT1BP, and OUT1BN Pins)

2 V

Input/Output Supply Voltage

(VDDIOA and VDDIOB)

3.6 V

Input Voltage Range (XOA, XOB, REFA,

REFAA, REFB, and REFBB Pins)

−0.5 V to VDD + 0.5 V

Digital Input Voltage Range

SDO/M5, SCLK/SCL, SDIO/SDA,

and CSB/M6 Pins

−0.5 V to VDDIOA + 0.5 V

M0, M1, M2, M3, and M4 Pins

−0.5 V to VDDIOB + 0.5 V

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering 10 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the junction to ambient thermal resistance, 0.0 m/sec

airflow per JEDEC JESD51-2 (still air).

θJMA is the junction to ambient thermal resistance, 1.0 m/sec

airflow or 2.5 m/sec airflow per JEDEC JESD51-6 (moving air).

θJC is the junction to case thermal resistance (die to heat sink)

per MIL-STD 883, Method 1012.1.

Values of θJA are for package comparison and PCB design

considerations. θJA provides for a first-order approximation

of TJ per the following equation:

TJ = TA + (θJA × PD)

where:

TA is the ambient temperature (°C).

PD is the power dissipation in watts.

Values of θJC are for package comparison and PCB design

considerations when an external heat sink is required.

Table 40. Thermal Resistance

Package Type

θJA

θJMA1

θJC

Unit

CP-48-132, 3

23.1

18.4, 17.1

0.7

°C/W

θJMA is 18.4°C/W at 1.0 m/sec airflow and 17.1°C/W at 2.5 m/sec airflow.

Thermal characteristics derived using a JEDEC51-7 plus JEDEC51-5 2S2P test

board. The exposed pad on the bottom of the package must be soldered to

ground to achieve the specified thermal performance.

Results are from simulations. The PCB is a JEDEC multilayer type. Thermal

performance for actual applications requires careful inspection of the

conditions in the application to determine if they are similar to those

assumed in these calculations.

ESD CAUTION

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