MPC8560CPX667JC datasheet(72/108 Pages) NXP

72 / 108 page

MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2

Freescale Semiconductor

Package and Pin Listings

3. Maximum solder ball diameter measured parallel to datum A.

4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls.

5. Capacitors may not be present on all devices.

6. Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.

7. The socket lid must always be oriented to A1.

14.3 Pinout Listings

Table 54 provides the pin-out listing for the MPC8560, 783 FC-PBGA package.

Table 54. MPC8560 Pinout Listing

Signal

Package Pin Number

Pin Type

Power

Supply

Notes

PCI/PCI-X

PCI_AD[63:0]

AA14, AB14, AC14, AD14, AE14, AF14, AG14, AH14,

V15, W15, Y15, AA15, AB15, AC15, AD15, AG15,

AH15, V16, W16, AB16, AC16, AD16, AE16, AF16,

V17, W17, Y17, AA17, AB17, AE17, AF17, AF18, AH6,

AD7, AE7, AH7, AB8, AC8, AF8, AG8, AD9, AE9, AF9,

AG9, AH9, W10, Y10, AA10, AE11, AF11, AG11,

AH11, V12, W12, Y12, AB12, AD12, AE12, AG12,

AH12, V13, Y13, AB13, AC13

I/O

OVDD

PCI_C_BE[7:0]

AG13, AH13, V14, W14, AH8, AB10, AD11, AC12

I/O

OVDD

PCI_PAR

AA11

I/O

OVDD

—

PCI_PAR64

Y14

I/O

OVDD

—

PCI_FRAME

AC10

I/O

OVDD

PCI_TRDY

AG10

I/O

OVDD

PCI_IRDY

AD10

I/O

OVDD

PCI_STOP

V11

I/O

OVDD

PCI_DEVSEL

AH10

I/O

OVDD

PCI_IDSEL

AA9

OVDD

—

PCI_REQ64

AE13

I/O

OVDD

5, 10

PCI_ACK64

AD13

I/O

OVDD

PCI_PERR

W11

I/O

OVDD

PCI_SERR

Y11

I/O

OVDD

2, 4

PCI_REQ0

AF5

I/O

OVDD

—

PCI_REQ[1:4]

AF3, AE4, AG4, AE5

OVDD

—

PCI_GNT[0]

AE6

I/O

OVDD

—

PCI_GNT[1:4]

AG5, AH5, AF6, AG6

OVDD

5, 9

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