MPC8560CPX667JC datasheet(90/108 Pages) NXP

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MPC8560CPX667JC データシート(PDF) 90 Page - NXP Semiconductors

部品番号	MPC8560CPX667JC

部品情報	Integrated Processor Hardware Specifications

PDF	108 Pages

Scroll/Zoom	100%

メーカー	NXP [NXP Semiconductors]

ホームページ	http://www.nxp.com

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90 / 108 page

MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2

Freescale Semiconductor

Thermal

The spring mounting should be designed to apply the force only directly above the die. By localizing the

force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to

the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the

opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the

package. Figure 56 and Figure 57 provide exploded views of the plastic fence, heat sink, and spring clip.

Figure 56. Exploded Views (1) of a Heat Sink Attachment using a Plastic Force

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