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FXLS8964AF データシート(PDF) 82 Page - NXP Semiconductors |
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FXLS8964AF データシート(HTML) 82 Page - NXP Semiconductors |
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82 / 98 page  NXP Semiconductors FXLS8964AF 3-Axis Low-g Accelerometer aaa-040832 C1 0.1 µF R1 R2 1 2 3 4 5 10 9 8 7 6 VDD VDD VDD BT_MODE GND INTF_SEL INT1/MOT_DET SPI_CS_B/WAKE_UP INT2/EXT_TRIG/BOOT_OUT INT1 SPI_CS_B/WAKE_UP INT2/EXT_TRIG SA0/SPI_MISO SPI_DATA SCLK SDA/SPI_MOSI/SPI_DATA SCL/SCLK C2 1.0 µF Figure 22. Typical Application Circuit #4 – SPI 3-wire mode (hardwired; SENS_CONFIG1[SPI_M] = X) Notes: • The external trigger function can be used to trigger a single shot measurement of the XYZ acceleration and temperature data. This mode is useful for synchronizing measurements with an external system or for creating user-specific ODRs. The measurement is triggered on the rising edge of the EXT_TRIG signal. • Resistors R1 and R2 are not needed if the interrupt output driver type is configured for push-pull operation (default). A suggested range for open-drain configuration is 10 kΩ to 100 kΩ. • If the INT1 pin, INT2 pin, or both pins are not used in the application, leave the unused pins unconnected. • The SPI_CS_B pin also serves as a signal to wake the device from Hibernate mode. • See Section 13.2 and Section 13.4 for more details on 3-wire SPI mode. aaa-040833 C1 0.1 µF R1 R2 (optional) (optional) 1 2 3 4 5 10 9 7 8 6 VDD VDD VDD BT_MODE GND INTF_SEL SPI_CS_B/WAKE_UP INT1/MOT_DET INT2/EXT_TRIG/BOOT_OUT MOT_DET BOOT_OUT SA0/SPI_MISO SDA/SPI_MOSI/SPI_DATA SCL/SCLK C2 1.0 µF Figure 23. Typical Application Circuit #5 – Motion detection mode (no serial interface) aaa-040834 C1 0.1 µF R1 R2 (optional) (optional) 1 2 3 4 5 10 9 7 8 6 VDD VDD VDD BT_MODE GND INTF_SEL INT1/MOT_DET SPI_CS_B/WAKE_UP INT2/EXT_TRIG/BOOT_OUT MOT_DET SPI_CS_B/WAKE_UP BOOT_OUT DNC SDA/SPI_MOSI/SPI_DATA SCL/SCLK SPI_DATA SCLK C2 1.0 µF Figure 24. Typical Application Circuit #6 - Motion detection mode (with SPI 3-wire interface, software enabled) FXLS8964AF All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 3.4 — 7 December 2021 82 / 98 |
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