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NM29N16 データシート(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部品番号 NM29N16
部品情報  16 MBit (2M x 8 Bit) CMOS NAND FLASH E2PROM
PDF  30 Pages
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メーカー  NSC [National Semiconductor (TI)]
ホームページ  http://www.national.com
Logo NSC - National Semiconductor (TI)

NM29N16 データシート(HTML) 3 Page - National Semiconductor (TI)

  NM29N16 Datasheet HTML 1Page - National Semiconductor (TI) NM29N16 Datasheet HTML 2Page - National Semiconductor (TI) NM29N16 Datasheet HTML 3Page - National Semiconductor (TI) NM29N16 Datasheet HTML 4Page - National Semiconductor (TI) NM29N16 Datasheet HTML 5Page - National Semiconductor (TI) NM29N16 Datasheet HTML 6Page - National Semiconductor (TI) NM29N16 Datasheet HTML 7Page - National Semiconductor (TI) NM29N16 Datasheet HTML 8Page - National Semiconductor (TI) NM29N16 Datasheet HTML 9Page - National Semiconductor (TI) Next Button
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Absolute Maximum Ratings
If MilitaryAerospace specified devices are required
please contact the National Semiconductor Sales
OfficeDistributors for availability and specifications
Power Supply (VCC)
b
06V to 70V
Input Voltage (VIN)
b
06V to 70V
InputOutput Voltage (VIO)
b
06V to VCC g05V (s7V)
Power Dissipation (PD)
05W
Soldering Temperature (Tsolder) (10 seconds)
260 C
Storage Temperature (Tstg)
b
55 Cto150 C
Operating Temperature (Topr)0 Cto70 C
Recommended Operating
Conditions
Min
Typ
Max
Units
Power Supply (VCC)
45
50
55
V
High Level Input Voltage (VIH) 24
VCC a 05
V
Low Level Input Voltage (VIL) b03
08
V
b
2V (Pulse Width k 20 ns)
DC Operating Characteristics (TA e 0 Cto70 C VCC e 5V g10%)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
ILI
Input Leakage Current
VIN e 0V to VCC
g
10
m
A
ILO
Output Leakage Current
VOUT e 04V to VCC
g
10
m
A
ICC01
Operating Current (Serial Read)
CE e VIL
tCYCLE e 80 ns
15
30
mA
ICC02
Operating Current (Serial Read)
IOUT e 0mA
tCYCLE e 1 ms5
mA
ICC03
Operating Current (Command Input)
tCYCLE e 80 ns
15
30
mA
ICC04
Operating Current (Data Input)
tCYCLE e 80 ns
50
70
mA
ICC05
Operating Current (Address Input)
tCYCLE e 80 ns
15
30
mA
ICC06
Operating Current (Register Read)
tCYCLE e 80 ns
15
30
mA
ICC07
Programming Current
40
60
mA
ICC08
Erasing Current
20
40
mA
ICCS1
Standby Current
CE e VIH
1mA
ICCS2
Standby Current
CE e VCC b 02V
100
m
A
VOH
High Level Output Voltage
IOH eb400 mA
24
V
VOL
Low Level Output Voltage
IOL e 21 mA
04
V
IOL(RB)
Output Current of (RB) Pin
VOL e 04V
10
mA
Pin Functions
The NM29N16 is a sequential access memory which utilizes
time sharing input of address and data information
Command Latch Enable CLE
The CLE input signal is
used to control the input of commands into the internal
command register The command is latched into the com-
mand register from the IO port at the rising edge of the WE
signal while CLE is high
Address Latch Enable ALE
The ALE signal is used to
control the input of either address information or input data
into the internal addressdata register Address information
is latched at the rising edge of WE if ALE is high Input data
is latched if ALE is low
Chip Enable CE
The device goes into a low power stand-
by mode during a read operation when CE goes high The
CE signal is ignored when the device is in a busy state (RB
e
L) such as during a program or erase operation and will
not go into standby mode if a CE high signal is input
Write Enable
WE
The WE signal is used to strobe data
into the IO port
Read Enable RE
The RE signal strobes data output Data
is available tREA after the falling edge of RE The internal
column address counter is also incremented (Address a 1)
with this falling edge
IO Port IO 1 – 8
The IO 1 – 8 pins are used as the port for
transferring address command and inputoutput data infor-
mation to or from the device
Write Protect
WP
The WP signal is used to protect the
device from inadvertent programming or erasing The inter-
nal voltage regulator is reset when WP is low This signal is
usually used for protecting the data during the power onoff
sequence when the input signals are invalid
ReadyBusy RB
The RB output signal is used to indi-
cate the operating condition of the device The RB signal is
in a busy state (RB e L) during the program erase or read
operations and will return to a ready state (RB e H) after
completion The output buffer of this signal is an open drain
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