データシートサーチシステム
  Japanese  ▼
ALLDATASHEET.JP

X  

VD66GY データシート(PDF) 33 Page - STMicroelectronics

部品番号 VD66GY
部品情報  Compact, high-sensitive 1.5 megapixel color Bayer global shutter image sensor
PDF  37 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

VD66GY データシート(HTML) 33 Page - STMicroelectronics

Back Button VD66GY Datasheet HTML 29Page - STMicroelectronics VD66GY Datasheet HTML 30Page - STMicroelectronics VD66GY Datasheet HTML 31Page - STMicroelectronics VD66GY Datasheet HTML 32Page - STMicroelectronics VD66GY Datasheet HTML 33Page - STMicroelectronics VD66GY Datasheet HTML 34Page - STMicroelectronics VD66GY Datasheet HTML 35Page - STMicroelectronics VD66GY Datasheet HTML 36Page - STMicroelectronics VD66GY Datasheet HTML 37Page - STMicroelectronics  
Zoom Inzoom in Zoom Outzoom out
 33 / 37 page
background image
9.2
Storage information
Store all packing material in an appropriate indoor area. This is to prevent any dust and/or damage from the sun,
external light, and physical shocks.
Keep the temperature between 15ºC and 35ºC.
Keep the relative humidity range between 10% and 70% maximum.
Store the reconstructed wafers under vacuum, in their original supplied sealed packing until they are used.
After the packing seal is broken, store the reconstructed wafers under nitrogen (N2) within dedicated closed
shelves until they are processed.
Use the trace code to count the storage time. It is written on the package label.
The maximum storage time of the reconstructed wafer is:
Six months from the trace code date. This is when the wafer is kept in the original sealed packing.
One week from the trace code date. This is when the original packing seal is open.
The maximum storage time defines the maximum time that can be waited for reconstructed wafer processing.
Processing may be for picking and placing, and module integration. If the maximm storage time is not respected,
safe processing is not guaranteed.
Note:
For further information on reconstructed wafer specifications for visual inspection and packing, refer to the
technical note TN1497.
VD66GY
Package information
DS13838 - Rev 7
page 33/37



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37


データシート ダウンロード

Go To PDF Page


リンク URL



ALLDATASHEETはお客様のビジネスに役立ちますか?  [ DONATE ] 

Alldatasheetは   |   広告   |   お問い合わせ   |   プライバシーポリシー   |   データシートへのリンク    |   リンク交換   |   メーカーリスト
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com