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M58LT128HST データシート(PDF) 72 Page - STMicroelectronics |
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M58LT128HST データシート(HTML) 72 Page - STMicroelectronics |
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72 / 110 page ![]() Part numbering M58LT128HST, M58LT128HSB 72/110 14 Part numbering Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device, please contact the ST Sales Office nearest to you. Table 28. Ordering information scheme Example: M58LT128HST 8 ZA 6 E Device type M58 Architecture L = Multilevel, Multiple Bank, Burst Mode Operating voltage T = VDD = 1.7 V to 2.0 V, VDDQ = 2.7 V to 3.6 V Density 128 = 128 Mbit (x16) Technology H = 90nm technology Security S = Secure Parameter location T = Top Boot B = Bottom Boot Speed 8 = 85 ns Package ZA = TBGA64, 10 × 13 mm, 1 mm pitch Temperature range 6 = –40 to 85°C Packing option E = ECOPACK® Package, Standard Packing F = ECOPACK® Package, Tape & Reel Packing |
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