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L99DZ81EP データシート(PDF) 13 Page - STMicroelectronics |
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L99DZ81EP データシート(HTML) 13 Page - STMicroelectronics |
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13 / 62 page  DocID023145 Rev 2 13/62 L99DZ81EP Electrical specifications 61 2.4 Package and PCB thermal data 2.4.1 TQFP-64 thermal data Figure 3. TQFP-64 2 layer PCB Figure 4. TQFP-64 4 layer PCB Note: Layout condition of Rth and Zth measurements (board finish thickness 1.6 mm +/- 10%, board double layer and four layers, board dimension 77 mm x114 mm, board material FR4, Cu thickness 0.070mm (outer layers), Cu thickness 0.035mm (inner layers), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, footprint dimension 6 mm x 6 mm). 4-layer PCB: Cu on mid1 layer, Cu on mid2 layer and Cu on bottom layer: 62 cm2. Zth measured on the major power dissipator contributor |
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