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H5GQ1H24AFR-R0C データシート(PDF) 152 Page - Hynix Semiconductor

部品番号 H5GQ1H24AFR-R0C
部品情報  1Gb (32Mx32) GDDR5 SGRAM
PDF  173 Pages
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メーカー  HYNIX [Hynix Semiconductor]
ホームページ  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor

H5GQ1H24AFR-R0C データシート(HTML) 152 Page - Hynix Semiconductor

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Rev. 1.0 /Nov. 2009
152
H5GQ1H24AFR
aq. The WRITE latency WLmrs cna be set to 3 to 7 clocks. When the WRITE latency is set to small values (3 ~ 4 clocks), the input buffers are always on,
reducing the latency but adding power. When the WRITE latency is set to larger values (5 ~ 7 clocks), the input buffers are turned on with the WRITE
command, thus saving power.
ar. Read data including CRC data must have been clocked out before entering self refresh or power down mode.
as. Write data must have been written to the memory core and CRC data must have been clocked out before entering self refresh or power down mode.
at. Time for WCK2CK training and data training not included.
au. A maximum of 8 consecutive REFRESH commands can be posted to a GDDR5 SGRAM device, meaning that the maximum absolute interval
between any REFRESH command and the next REFRESH command is 9*tREFI.
av. Replaces parameter tLK when PLL Fast Lock has been neabled prior to the PLL enable or reset.
aw. Replaces parameter tLK when PLL Standby has been enabed and the WCK clock frequency has not charged while in standby mode.
ax. The PLL standby time tSTDBY ismeasured from self refresh entry until after self refresh exit a subsequent PLL reset is given (with PLL Standby
enabled)



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