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LT1956IGN データシート(PDF) 17 Page - Linear Technology |
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LT1956IGN データシート(HTML) 17 Page - Linear Technology |
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17 / 28 page ![]() 17 LT1956/LT1956-5 1956f APPLICATIO S I FOR ATIO LAYOUT CONSIDERATIONS As with all high frequency switchers, when considering layout, care must be taken in order to achieve optimal electrical, thermal and noise performance. For maximum efficiency, switch rise and fall times are typically in the nanosecond range. To prevent noise both radiated and conducted, the high speed switching current path, shown in Figure 5, must be kept as short as possible. This is implemented in the suggested layout of Figure 6. Shorten- ing this path will also reduce the parasitic trace inductance of approximately 25nH/inch. At switch off, this parasitic inductance produces a flyback spike across the LT1956 switch. When operating at higher currents and input voltages, with poor layout, this spike can generate volt- ages across the LT1956 that may exceed its absolute maximum rating. A ground plane should always be used under the switcher circuitry to prevent interplane coupling and overall noise. The VC and FB components should be kept as far away as possible from the switch and boost nodes. The LT1956 pinout has been designed to aid in this. The ground for these components should be separated from the switch current path. Failure to do so will result in poor stability or subharmonic like oscillation. Figure 6. Suggested Layout GND GND SHDN SYNC GND BOOST VIN SW PLACE FEEDTHROUGH AROUND GROUND PINS (4 CORNERS) FOR GOOD THERMAL CONDUCTIVITY LT1956 C3 C1 D1 C2 D2 R2 R1 1956 F06 CFB CF RC CC L1 MINIMIZE LT1956 C3-D1 LOOP GND GND BIAS FB VC CONNECT TO GROUND PLANE KELVIN SENSE VOUT KEEP FB AND VC COMPONENTS AWAY FROM HIGH FREQUENCY, HIGH CURRENT COMPONENTS GND VOUT VIN FOR THE FE PACKAGE, SOLDER THE EXPOSED PAD TO THE COPPER GROUND PLANE UNDERNEATH THE DEVICE 1956 F05 5V L1 VIN LT1956 D1 C1 C3 HIGH FREQUENCY CIRCULATING PATH LOAD Figure 5. High Speed Switching Path |
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