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LM10506 データシート(PDF) 36 Page - Texas Instruments |
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LM10506 データシート(HTML) 36 Page - Texas Instruments |
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36 / 43 page ![]() LM10506 SNVS729F – SEPTEMBER 2011 – REVISED AUGUST 2014 www.ti.com Layout Guidelines (continued) 11.1.2 PCB Layout Thermal Dissipation For DSBGA Package 1. Position ground layer as close as possible to DSBGA package. Second PCB layer is usually good option. LM10506 evaluation board is a good example. 2. Draw power traces as wide as possible. Bumps which carry high currents should be connected to wide traces. This helps the silicon to cool down. 11.2 Layout Example Figure 29. Possible PCB Layout Configuration 6x Through Hole Vias In The Middle 36 Submit Documentation Feedback Copyright © 2011–2014, Texas Instruments Incorporated Product Folder Links: LM10506 |
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