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AN4068 データシート(PDF) 45 Page - STMicroelectronics |
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AN4068 データシート(HTML) 45 Page - STMicroelectronics |
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45 / 63 page  AN4068 Design guidelines Doc ID 022923 Rev 2 45/63 Equation 10 where TA is the ambient temperature (from -40 to +85 °C) and ZthJA is the junction to ambient thermal impedance of the ST7580 IC, which is related to the length of the transmission (tTX) and to the duty cycle d = tPKT / (tPKT + tIDLE), assuming a packet- fragmented transmission as illustrated by Figure 36. Figure 36. Packet-fragmented transmission When soldered to a proper dissipating area on the PCB as explained above, the ST7580 IC is characterized by a steady-state thermal resistance RthJA of about 50 °C/W. The thermal impedance curve obtained as the power dissipation step response is given in Figure 37. Figure 37. Measured ST7580 thermal impedance curve (typical) It can be seen that the transient of ZthJA takes some thousand seconds, after which the static value of 50 °C/W is reached. This means that during the transient phase (i.e. if the transmission time tTX is some seconds or even less) the IC is able to dissipate a power that is far higher than the one sustainable at steady-state. ) d , t ( Zth P T ) d , t ( T TX JA D A TX J ⋅ + = |
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