LM10504_15 datasheet(4/38 Pages) TI1

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LM10504

SNVS739E – DECEMBER 2011 – REVISED MARCH 2013

www.ti.com

Table 2. PIN DESCRIPTIONS (continued)

Pin #

Pin Name

I/O(1)

Type(2)

Functional Description

Digital Input Startup Control Signal to change predefined output Voltage of Buck 3,

Vselect_B3

internally pulled up as a default.

Digital Input Control Signal for entering Device Sleep Mode. This is an active High pin

DevSLP

with an internal pulldown resistor. Lowers core ASIC voltage and turns off the FLASH

and I/O bucks.

Digital Input Control Signal to abort SPI transactions; resets the PMIC to default

RESET

voltages. This is an active Low pin with an internal pullup.

VCOMP

Analog Input for Comparator

Interrupt

Digital Output of Comparator to signal interrupt condition

SPI_CS

SPI Interface - chip select

SPI_DI

SPI Interface - serial data input

SPI_DO

SPI Interface - serial data output

SPI_CLK

SPI Interface - serial clock input

VIN_IO

Supply Voltage for Digital Interface

GND

Ground. Connect to system Ground.

GND

Ground. Connect to system Ground.

GND

Connect to system Ground; decouple closely to A3.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

VIN, VCOMP

−0.3V to +6.0V

VIN_IO, VIN_B1, VIN_B2, VIN_B3, SPI_CS, SPI_DI, SPI_CLK, SPI_DO, Vselect_B2,Vselect_B3,

RESET, SW_1, SW_2, SW_3, FB_1, FB_2, FB_3, LDO, Interrupt, DevSLP

−0.3V to +6.0V

Junction Temperature (TJ-MAX)

150°C

Storage Temperature

−65°C to 150°C

ESD Rating

Human Body Model (HBM)

2.0kV

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

Operating Ratings

(1) (2) (3)

VIN_B1, VIN_B2_VIN_B3, VIN

3.0V to 5.5V

VIN_IO

1.72V to 3.63V but < VIN

All pins other than VIN_IO

0V to VIN

Junction Temperature (TJ)

−30°C to 125°C

Ambient Temperature (TA)

−30°C to 85°C

Junction-to-Ambient Thermal Resistance (

θJA)

44.5°C/W

Maximum Continuous Power Dissipation (PD-MAX)

0.9W

(1)

Internal thermal shutdown protects device from permanent damage. Thermal shutdown engages at TJ = +140°C and disengages at TJ

= +120°C (typ.). Thermal shutdown is ensured by design.

(2)

In applications where high power dissipation and/or poor thermal resistance is present the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +125°C),

the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

(3)

The amount of Absolute Maximum power dissipation allowed for the device depends on the ambient temperature and can be calculated

using the formula: P = (TJ–TA)/θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-

ambient thermal resistance.

θJA is highly application and board-layout dependent. Internal thermal shutdown circuitry protects the device

from permanent damage. (See General Electrical Characteristics.)

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