データシートサーチシステム
  Japanese  ▼
ALLDATASHEET.JP

X  

TNETV1644ZDU6 データシート(PDF) 299 Page - Texas Instruments

Click here to check the latest version.
部品番号 TNETV1644ZDU6
部品情報  Digital Media Processor
PDF  306 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

TNETV1644ZDU6 データシート(HTML) 299 Page - Texas Instruments

Back Button TNETV1644ZDU6 Datasheet HTML 295Page - Texas Instruments TNETV1644ZDU6 Datasheet HTML 296Page - Texas Instruments TNETV1644ZDU6 Datasheet HTML 297Page - Texas Instruments TNETV1644ZDU6 Datasheet HTML 298Page - Texas Instruments TNETV1644ZDU6 Datasheet HTML 299Page - Texas Instruments TNETV1644ZDU6 Datasheet HTML 300Page - Texas Instruments TNETV1644ZDU6 Datasheet HTML 301Page - Texas Instruments TNETV1644ZDU6 Datasheet HTML 302Page - Texas Instruments TNETV1644ZDU6 Datasheet HTML 303Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 299 / 306 page
background image
7
Mechanical Data
7.1 Thermal Data for ZWT
TMS320DM6437
Digital Media Processor
www.ti.com
SPRS345D – NOVEMBER 2006 – REVISED JUNE 2008
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT and ZDU
mechanical package(s). For more details, see the Thermal Considerations for TMS320DM64xx,
TMS320DM64x, and TMS320C6000 Devices Application Report (literature number SPRAAL9).
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
°C/W(1)
AIR FLOW (m/s)(2)
1
R
ΘJC
Junction-to-case
5.4
N/A
2
R
ΘJB
Junction-to-board
16.0
N/A
3
26.6
0.00
4
R
ΘJA
Junction-to-free air
21.9
1.0
5
20.4
2.00
7
0.0
0.00
8
PsiJT
Junction-to-package top
0.1
1.0
9
0.2
2.00
11
15.9
0.00
12
PsiJB
Junction-to-board
15.8
1.0
13
15.3
2.00
(1)
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
•
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
.
(2)
m/s = meters per second
Submit Documentation Feedback
Mechanical Data
299



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


データシート ダウンロード

Go To PDF Page


リンク URL



ALLDATASHEETはお客様のビジネスに役立ちますか?  [ DONATE ] 

Alldatasheetは   |   広告   |   お問い合わせ   |   プライバシーポリシー   |   データシートへのリンク    |   リンク交換   |   メーカーリスト
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com