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TNETV1644ZDU6 データシート(PDF) 300 Page - Texas Instruments

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部品番号 TNETV1644ZDU6
部品情報  Digital Media Processor
PDF  306 Pages
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

TNETV1644ZDU6 データシート(HTML) 300 Page - Texas Instruments

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7.1.1 Thermal Data for ZDU
7.1.2 Packaging Information
TMS320DM6437
Digital Media Processor
SPRS345D – NOVEMBER 2006 – REVISED JUNE 2008
www.ti.com
Table 7-2. Thermal Resistance Characteristics (PBGA Package) [ZDU]
NO.
°C/W(1)
AIR FLOW (m/s)(2)
1
R
ΘJC
Junction-to-case
7.7
N/A
2
R
ΘJB
Junction-to-board
10.5
N/A
3
19.7
0.00
4
R
ΘJA
Junction-to-free air
15.5
1.0
5
14.3
2.00
7
4.9
0.00
8
PsiJT
Junction-to-package top
5.1
1.0
9
5.2
2.00
11
10.4
0.00
12
PsiJB
Junction-to-board
9.8
1.0
13
9.6
2.00
(1)
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
•
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
(2)
m/s = meters per second
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
300
Mechanical Data
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