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STM32L100RB データシート(PDF) 85 Page - STMicroelectronics

部品番号 STM32L100RB
部品情報  Ultra-low-power platform
PDF  103 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L100RB データシート(HTML) 85 Page - STMicroelectronics

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DocID024295 Rev 5
85/103
STM32L100C6 STM32L100R8/RB
Electrical characteristics
90
Figure 24. Maximum dynamic current consumption on VDDA supply pin during ADC
conversion
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 8, depending on whether
VREF+ is connected to VDDA or not. The 100 nF capacitors should be ceramic (good quality).
They should be placed as close as possible to the chip.
ADC clock
Sampling (n cycles)
Conversion (12 cycles)
IDDA
1300 µA
1700 µA
MS36686V1
Table 55. Maximum source impedance RAIN max(1)
Ts
(µs)
RAIN max (kOhm)
Ts (cycles)
fADC= 16 MHz(2)
Multiplexed channels
Direct channels
2.4 V < VDDA< 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA< 3.3 V 1.8 V < VDDA < 2.4 V
0.25
Not allowed
Not allowed
0.7
Not allowed
4
0.5625
0.8
Not allowed
2.0
1.0
9
1
2.0
0.8
4.0
3.0
16
1.5
3.0
1.8
6.0
4.5
24
3
6.8
4.0
15.0
10.0
48
6
15.0
10.0
30.0
20.0
96
12
32.0
25.0
50.0
40.0
192
24
50.0
50.0
50.0
50.0
384
1. Guaranteed by design.
2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be
reduced with respect to the minimum sampling time Ts (us).



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