GD25VQ64CSIG datasheet(34/63 Pages) GIGADEVICE

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2.5V Uniform Sector

Dual and Quad Serial Flash

GD25VQ64C

When used to release the device from the Power-Down state and obtain the Device ID, the command is the same as

previously described, and shown in Figure27, except that after CS# is driven high it must remain high for a time duration

of tRES2 (See AC Characteristics). After this time duration the device will resume normal operation and other command will

be accepted. If the Release from Power-Down / Device ID command is issued while an Erase, Program or Write cycle is

in process (when WIP equal 1) the command is ignored and will not have any effects on the current cycle.

Figure 26. Release Power-Down Sequence or High Performance Mode Sequence Diagram

Figure 27. Release Power-Down/Read Device ID Sequence Diagram

7.23.

Read Manufacture ID/ Device ID (REMS) (90H)

The Read Manufacturer/Device ID command is an alternative to the Release from Power-Down / Device ID command that

provides both the JEDEC assigned Manufacturer ID and the specific Device ID.

The command is initiated by driving the CS# pin low and shifting the command code “90H” followed by a 24-bit address

(A23-A0) of 000000H. After which, the Manufacturer ID and the Device ID are shifted out on the falling edge of SCLK with

most significant bit (MSB) first as shown below. If the 24-bit address is initially set to 000001H, the Device ID will be read

first.

Command

ABH

CS#

SCLK

RES1

Stand-by mode

Deep Power-down mode

Command

ABH

CS#

SCLK

29 30 31

MSB

3 Dummy Bytes

23 22

32 33 34 35 36 37 38

MSB

t RES2

Stand-by Mode

Deep Power-down Mode

High-Z

Device ID

GD25VQ64CSIG データシート(PDF) 34 Page - GigaDevice Semiconductor (Beijing) Inc.

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