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CC3235MODASF データシート(PDF) 98 Page - Texas Instruments |
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CC3235MODASF データシート(HTML) 98 Page - Texas Instruments |
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98 / 100 page  www.ti.com EXAMPLE BOARD LAYOUT 54X ( 0.81) (1.27) TYP (19.048) 9X ( 2) (1.5) 6X (3) (1.5) 6X (3) 0.05 MIN ALL AROUND (25) (20.5) (0.65) TYP (0.65) TYP ( 0.2) TYP VIA (R0.05) ALL PADS ( 8.1) 0.05 MIN TYP (3.724) (8.05) (4.326) QFM - 2.4 mm max height MON0063A QUAD FLAT MODULE 4223415/C 06/2019 NOTES: (continued) 3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE:5X PATTERN PKG SEE DETAIL 1 16 17 27 28 43 44 54 55 57 58 60 63 61 METAL UNDER SOLDER MASK SOLDER MASK OPENING 9X (45 X 1) 56 59 62 2 15 29 42 PKG NO TRACES, VIAS, GND PLANE OR SILK SCREEN SHOULD BE LOCATED WITHIN THIS AREA SOLDER MASK OPENING METAL UNDER SOLDER MASK SIGNAL PADS DETAIL EXPOSED METAL |
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