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MPC8347ECVRADDB データシート(PDF) 56 Page - NXP Semiconductors |
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MPC8347ECVRADDB データシート(HTML) 56 Page - NXP Semiconductors |
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56 / 99 page  MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12 56 Freescale Semiconductor Package and Pin Listings 18.2 Mechanical Dimensions for the MPC8347EA TBGA Figure 40 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347EA, 672-TBGA package. Figure 40. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347EA TBGA Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement must exclude any effect of mark on top surface of package. |
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