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MPC7410EC データシート(PDF) 45 Page - NXP Semiconductors |
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MPC7410EC データシート(HTML) 45 Page - NXP Semiconductors |
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45 / 56 page  MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor 45 System Design Information Figure 29 describes the thermal performance of selected thermal interface materials. Figure 29. Thermal Performance of Select Thermal Interface Material The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected based on high conductivity, yet adequate mechanical strength to meet equipment shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive materials provided by the following vendors: Chomerics, Inc. 781-935-4850 77 Dragon Court Woburn, MA 01888-4014 Internet: www.chomerics.com Dow-Corning Corporation 800-248-2481 Dow-Corning Electronic Materials 2200 W. Salzburg Rd. Midland, MI 48686-0997 Internet: www.dow.com Shin-Etsu MicroSi, Inc. 888-642-7674 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com 0 0.5 1 1.5 2 0 10 20 3040506070 80 Silicone Sheet (0.006") Bare Joint Floroether Oil Sheet (0.007") Graphite/Oil Sheet (0.005") Synthetic Grease Contact Pressure (psi) |
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