MPC7410EC datasheet(11/56 Pages) NXP

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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

Electrical and Thermal Characteristics

Table 5 provides the DC electrical characteristics for the MPC7410.

Junction-to-case thermal resistance

RθJC

< 0.1

°C/W

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

2. Per JEDEC JESD51-6 with the board horizontal.

3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

4. Thermal resistance between the active portion of the die and the calculated case temperature at the top of the die.

The actual value of R JC is less than 0.1 °C/W.

Note: Refer to Section 8.8, “Thermal Management Information,” for details on thermal management.

Table 5. DC Electrical Specifications

At recommended operating conditions (see Table 3)

Characteristic

Nominal

Bus

Voltage1

Symbol

Min

Max

Unit

Notes

Input high voltage (all inputs except

SYSCLK)

1.8

VIH

0.65

× (L2)OVDD

(L2)OVDD + 0.2

2, 3, 8

2.5

VIH

1.7

(L2)OVDD + 0.2

3.3

VIH

2.0

OVDD + 0.3

Input low voltage (all inputs except

SYSCLK)

1.8

VIL

–0.3

0.35

× (L2)OVDD

2.5

VIL

–0.3

0.2

× (L2)OVDD

3.3

VIL

–0.3

0.8

SYSCLK input high voltage

1.8

CVIH

1.5

OVDD + 0.2

2, 8

2.5

CVIH

2.0

OVDD + 0.2

3.3

CVIH

2.4

OVDD + 0.3

SYSCLK input low voltage

1.8

CVIL

–0.3

0.2

2.5

CVIL

–0.3

0.4

3.3

CVIL

–0.3

0.4

Input leakage current,

Vin = L2OVDD/OVDD

1.8

Iin

—20

µA

2, 3,

6, 7

2.5

Iin

—35

3.3

Iin

—70

Table 4. Package Thermal Characteristics (continued)

Characteristic

Symbol

Value

Unit

Notes

MPC7410

CBGA

MPC7410

HCTE

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