LCR1210-R100F datasheet(40/59 Pages) SKYWORKS

40 / 59 page

Si32260/1

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

Rev. 1.4 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 7, 2021

SDI

Serial Port Data Input.

Serial port control data input.

SVBATb

VBAT Sense—Channel B.

Input to sense voltage on VBAT.

CAPMb

SLIC Stabilization Capacitor—Channel B.

Capacitor used in low pass filter.

CAPPb

SLIC Stabilization Capacitor—Channel B.

Capacitor used in low pass filter.

IREF

Current Reference Input.

Connects to an external resistor used to provide a high accuracy reference current.

STIPDCb

TIP DC Sense Input—Channel B.

Analog dc input to detect voltage on the channel B TIP lead.

STIPACb

TIP AC Sense Input—Channel B.

Analog ac input to sense voltage on the channel B TIP lead.

SRINGACb

RING AC Sense Input—Channel B.

Analog ac input to sense voltage on the channel B RING lead.

SRINGDCb

RING DC Sense Input—Channel B.

Analog dc input to sense voltage on the channel B RING lead.

GPIO1b/STIPCb

General Purpose I/O or TIP Coarse Sense Input—Channel B.

TIP channel A voltage sensing outside protection circuit.

GPIO2b/SRINGCb

General Purpose I/O or RING Coarse Sense Input—Channel B.

RING channel A Voltage sensing outside protection circuit.

VDDA

Analog Supply Voltage.

Analog power supply for internal analog circuitry.

TIPb

TIP Terminal—Channel B.

Connect to the TIP lead of the channel B subscriber loop.

RINGb

RING Terminal—Channel B.

Connect to the RING lead of the channel B subscriber loop.

VBATb

Battery Voltage Supply—Channel B.

Connect to battery supply for Channel B.

VBATa

Battery Voltage Supply—Channel A.

Connect to battery supply for Channel A.

RINGa

RING Terminal—Channel A.

Connect to the RING lead of the channel A subscriber loop.

TIPa

TIP Terminal—Channel A.

Connect to the TIP lead of the channel A subscriber loop.

HVPAD

Exposed paddle.

Connect to electrically-isolated low thermal impedance inner layer and/or backside

thermal plane using multiple thermal vias.

GNDPAD

Exposed paddle.

Connect to ground.

Pin #

Pin Name

Description

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