LCR1210-R100F datasheet(18/59 Pages) SKYWORKS

18 / 59 page

Si32260/1

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

Rev. 1.4 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 7, 2021

Table 10. Thermal Conditions

Parameter

Symbol

Test Condition

Value

Unit

Thermal Resistance, Typical*

QFN-60

JA

°C/W

JB

JC

Thermal Resistance, Typical*

QFN-47

JA

°C/W

JB

JC

Maximum Junction Temperature,

QFN-60, QFN-47(Linefeed Die)

TJHV

Continuous

145

°C

Maximum Junction Temperature

QFN-60,QFN-47 (Low Voltage Die)

TJLV

125

°C

*Note:

1. The thermal resistance of an exposed pad package is assured when the recommended printed circuit board layout

guidelines are followed correctly. The specified performance requires that the exposed pad be soldered to an exposed

copper surface of at least equal size and that multiple vias are added to enable heat transfer between the top-side

copper surface and a large internal/bottom copper plane. Thermal resistance values are empirical measurements taken

from Skyworks Solutions EVBs.

2. Operation of the Si3226x above 125 °C junction temperature may degrade device reliability.

3. The Si3226x linefeed is equipped with on-chip thermal limiting circuitry that shuts down the circuit when the junction

temperature exceeds the thermal shutdown threshold. The thermal shutdown threshold should normally be set to

145 °C; when in the ringing state with cadence the thermal shutdown may be set to 200 °C. For optimal reliability, long

term operation of the Si3226x linefeed above 150 °C junction temperature should be avoided.

Table 11. Absolute Maximum Ratings1

Parameter

Symbol

Test Condition

Value

Unit

Storage Temperature Range

TSTG

–55 to 150

°C

Continuous Power Dissipation2,3

QFN-60

TA =85°C

1.4

Continuous Power Dissipation

QFN-47

TA = 85 °C

1.25

Supply Voltage

VDDD, VDDA

–0.5 to 4.0

Digital Input Voltage

VIND

–0.3 to 3.6

Battery Supply Voltage4, Si32260

VBAT

+0.4 to –115

Notes:

1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be

restricted to the conditions as specified in the operational sections of this data sheet.

2. Operation of the Si32260/1 low voltage die above 125 °C junction temperature may degrade device reliability.

3. Si32260/1 linefeed is equipped with on-chip thermal limiting circuitry that shuts down the circuit when the junction

temperature exceeds the thermal shutdown threshold.

4. The dv/dt of the voltage applied to the VBAT pins must be limited to 10 V/µs.

5. Specification requires circuit for surge event as shown in typical application circuit. Refer to “AN381: Si3226x ProSLIC

Designer’s Guide.”

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