ISL91211AIK, ISL91211BIK

2. Specifications

FN9344 Rev.1.02

Page 9 of 53

Feb.25.20

2.

Specifications

2.1

Absolute Maximum Ratings

2.2

Thermal Information

2.3

Recommended Operation Conditions

Parameter

Minimum

Maximum

Unit

PVIN and AVIN Pins to PGND

-0.3

+6

V

VOUT Pin (BUCKx_VOUTFBDIV[1:0] = 0x00)

-0.3

+2.0

V

VOUT Pin (BUCKx_VOUTFBDIV[1:0] = 0x01)

-0.3

+2.4

V

VOUT Pin (BUCKx_VOUTFBDIV[1:0] = 0x02)

-0.3

+3.0

V

PH to PGND

-0.3

+0.3 + PVIN

V

VIO, EN Pins to GND

-0.3

+0.3 + AVIN

V

RTN, GND to PGND

-0.3

+0.3

V

INT, WDOG_RST, MPIO, GPIO Pins to GND

-0.3

+0.3 + VIO

V

ESD Rating (Note 6)Value

Unit

Human Body Model (Tested per JS-001-2017)

2

kV

Charged Device Model (Tested per JS-002-2014)

750

V

Latch-Up (Tested per JESD78E; Class 2, Level A)

100

mA

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely

impact product reliability and result in failures not covered by warranty.

Note:

6. ESD ratings apply to external pins only.

Thermal Resistance (Typical)

θJA (°C/W)

θJC (°C/W)

4.70mmx6.30mm, 35 Ball TFBGA Package (Notes 7, 8)47

3

Notes:

7. θJA is measured in free air with the component mounted on a high-effective thermal conductivity test board with direct attach features.

See TB379.

8. For θJC, the case temperature location is taken at the package top center.

Parameter

Minimum

Maximum

Unit

Maximum Junction Temperature

+150

°C

Maximum Storage Temperature Range

-65

+150

°C

Pb-Free Reflow Profile

See TB493

Parameter

Minimum

Maximum

Unit

Junction Temperature

-40

+125

°C

Supply Voltage

AVIN to GND

2.7

5.5

V

PVIN to PGNDx

2.7

5.5

V

VIO Voltage (VIO to PGND)

1.7

AVIN

V

INT, WDOG_RST, MPIO, GPIO

Pins to GND

0VIO

V