TMF8701 datasheet(56/66 Pages) OSRAM

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TMF8701 データシート(PDF) 56 Page - OSRAM GmbH

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Datasheet, Public

Page 55

[v2-00] 2023-Feb-21

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TMF8701 − Soldering & Storage Information

Soldering Information

The package has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The process,

equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 121:

Solder Reflow Profile Graph

Soldering & Storage

Information

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