TSC2017

SBAS472 – DECEMBER 2009

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

TYPICAL

TYPICAL

NO MISSING

INTEGRAL

GAIN

CODES

SPECIFIED

TRANSPORT

LINEARITY

ERROR

RESOLUTION

PACKAGE

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

MEDIA,

PRODUCT

(LSB)

(LSB)

(BITS)

TYPE

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

Small Tape

TSC2017IYZGT

12-Pin,

and Reel, 250

TSC2017I

±1.5

0.1

11

3 x 4 Array,

YZG

–40°C to +85°C

TSC2017I

Tape and

WCSP

TSC2017IYZGR

Reel, 3000

(1)

For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see

the TI website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

TSC2017

UNIT

Analog input X+, Y+, AUX to GND

–0.4 to VDD + 0.1

V

Voltage range

Analog input X–, Y– to GND

–0.4 to VDD + 0.1

V

VDD/REF pin to GND

–0.3 to +5

V

Digital input voltage to GND

–0.3 to VDD + 0.3

V

Digital output voltage to GND

–0.3 to VDD + 0.3

V

Power dissipation

(TJ Max - TA)/θJA

Low-K

113

Thermal impedance,

θJA

WCSP package

°C/W

High-K

62

Operating free-air temperature range, TA

–40 to +85

°C

Storage temperature range, TSTG

–65 to +150

°C

Junction temperature, TJ Max

+150

°C

IEC contact discharge(2)

X+, X–, Y+, Y–

±15

kV

IEC air discharge(2)

X+, X–, Y+, Y–

±25

kV

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to

absolute-maximum rated conditions for extended periods may affect device reliability.

(2)

Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.

2

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