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Thermal Specifications

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

Notes:

These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure

the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at

specified ICC. Please refer to the loadline specifications in Chapter 2, “Electrical Specifications.”

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the

maximum power that the processor can dissipate. TDP is measured at maximum TCASE.

These specifications are based on final silicon validation/characterization.

Power specifications are defined at all VIDs found in Table 2-10. The Dual-Core Intel Xeon Processor 5000

series may be shipped under multiple VIDs for each frequency.

FMB, or Flexible Motherboard, guideline provide a design target for meeting all planned processor

frequency requirements.

Table 6-6.

Dual-Core Intel Xeon 5000 Series (667 MHz) Thermal Profile B Table

Power (W)

TCASE_MAX (° C)

Power (W)

TCASE_MAX (° C)

P_profile_min_B=29.6

50.0

61.8

51.4

63.1

52.7

64.4

54.0

65.7

55.3

67.0

56.6

57.9

59.2

60.5

Table 6-7.

Dual-Core Intel Xeon Processor 5063 (MV) Thermal Specifications

Core Frequency

Thermal

Design Power

(W)

Minimum

TCASE

(°C)

Maximum TCASE

(°C)

Notes

Launch to FMB

Refer to Figure 6-3;

Table 6-8

1, 2, 3, 4,

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