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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

Mechanical Specifications

3.2

Processor Component Keepout Zones

The processor may contain components on the substrate that define component

keepout zone requirements. A thermal and mechanical solution design must not intrude

into the required keepout zones. Decoupling capacitors are typically mounted to either

the topside or land-side of the package substrate. See Figure 3-4 for keepout zones.

3.3

Package Loading Specifications

Table 3-1 provides dynamic and static load specifications for the processor package.

These mechanical load limits should not be exceeded during heatsink assembly,

mechanical stress testing or standard drop and shipping conditions. The heatsink

attach solutions must not include continuous stress onto the processor with the

exception of a uniform load to maintain the heatsink-to-processor thermal interface.

Also, any mechanical system or component testing should not exceed these limits. The

processor package substrate should not be used as a mechanical reference or load-

bearing surface for thermal or mechanical solutions. Please refer to the Dual-Core

Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines for further

details.

Notes:

These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top

surface.

This is the minimum and maximum static force that can be applied by the heatsink and retention solution

to maintain the heatsink and processor interface.

Loading limits are for the LGA771 socket.

Dynamic compressive load applies to all board thickness.

Dynamic loading is defined as an 11 ms duration average load superimposed on the static load

requirement.

Test condition used a heatsink mass of 1 lbm with 50 g acceleration measured at heatsink mass. The

dynamic portion of this specification in the product application can have flexibility in specific values, but the

ultimate product of mass times acceleration should not exceed this dynamic load.

Transient bend is defined as the transient board deflection during manufacturing such as board assembly

and system integration. It is a relatively slow bending event compared to shock and vibration tests.

For more information on the transient bend limits, please refer to the MAS document entitled

Manufacturing with Intel® Components using 771-land LGA Package that Interfaces with the Motherboard

via a LGA771 Socket.

Refer to the Dual-Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines for

information on heatsink clip load metrology.

Table 3-1.

Package Loading Specifications

Parameter

Board

Thickness

Min

Max

Unit

Notes

Static

Compressive Load

Apply for all

board thickness

from 1.57 mm

(0.062”) to

2.54 mm

(0.100”)

25mm

<R<

45mm

133

lbf

1, 2, 3, 9,

10, 11,

12, 13

R>45mm

311

lbf

Dynamic

Compressive Load

311 N (max static

compressive load) +

222 N dynamic loading

70 lbf (max static

compressive load) +

50 lbf dynamic loading

lbf

1, 3, 4, 5,

Transient Bend

Limits

1.57 mm

0.062”

750

µε

1,3,7,8

2.16 mm

0.085”

700

2.54 mm

0.100”

650

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