MPC8248VR datasheet(56/61 Pages) FREESCALE

部品番号	MPC8248VR

部品情報	PowerQUICC II Family Hardware Specifications

PDF	61 Pages

Scroll/Zoom	100%

メーカー	FREESCALE [Freescale Semiconductor, Inc]

ホームページ	http://www.freescale.com

Logo

56 / 61 page

MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3

Freescale Semiconductor

Package Description

This figure shows the side profile of the PBGA package to indicate the direction of the top surface view.

Figure 13. Side View of the PBGA Package Remove

9.1

Package Parameters

This table provides package parameters.

NOTE: Temperature Reflow for the VR Package

In the VR package, sphere composition is lead-free (see Table 2). This

requires higher temperature reflow than what is required for other

PowerQUICC II packages. Consult “Freescale PowerQUICC II Pb-Free

Packaging Information” (MPC8250PBFREEPKG) available on

www.freescale.com.

Table 22. Package Parameters

Code

Type

Outline

(mm)

Interconnects

Pitch

(mm)

Nominal Unmounted

Height (mm)

VR, ZQ

PBGA

27 x 27

516

2.25

Die

Transfer molding compound

1 mm pitch

Wire bonds

attach

DIE

Ball bond

Screen-printed

solder mask

Cu substrate traces

Resin glass epoxy

Plated substrate via

MPC8248VR データシート(PDF) 56 Page - Freescale Semiconductor, Inc

MPC8248VR データシート(HTML) 56 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61

データシートダウンロード