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MPC7457 データシート(PDF) 45 Page - Freescale Semiconductor, Inc |
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MPC7457 データシート(HTML) 45 Page - Freescale Semiconductor, Inc |
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45 / 71 page ![]() Package Description MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8 Freescale Semiconductor 45 8.2 Mechanical Dimensions for the MPC7447, 360 CBGA Figure 20 provides the mechanical dimensions and bottom surface nomenclature for the MPC7447, 360 CBGA package. Figure 20. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7447, 360 CBGA Package NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. TOP SIDE A1 CORNER INDEX IS A METALIZED FEATURE WITH VARIOUS SHAPES. BOTTOM SIDE A1 CORNER IS DESIGNATED WITH A BALL MISSING FROM THE ARRAY. 0.2 C A 360X D 2X A1 CORNER E e 0.2 2X C B 123456789 10 111213141516 A B C D E F G H J K L M N P R T B 0.3 A 0.15 b A 0.15 A 17 18 19 U W V Millimeters DIM MIN MAX A 2.72 3.20 A1 0.80 1.00 A2 1.10 1.30 A3 — 0.6 b 0.82 0.93 D 25.00 BSC D1 — 11.3 D2 8.0 — D3 — 6.5 D4 10.9 11.1 e 1.27 BSC E 25.00 BSC E1 — 11.3 E2 8.0 — E3 — 6.5 E4 9.55 9.75 Capacitor Region D3 E2 E1 A A1 A2 A3 E4 D4 E3 D1 D2 0.35 A |
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