MPC7457 datasheet(14/71 Pages) FREESCALE

14 / 71 page

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8

Electrical and Thermal Characteristics

Freescale Semiconductor

Table 4 provides the recommended operating conditions for the MPC7457.

Table 5 provides the package thermal characteristics for the MPC7457.

Table 4. Recommended Operating Conditions 1

Characteristic

Symbol

Recommended Value

Unit

Notes

Min

Max

Core supply voltage

VDD

1.3 V ± 50 mV

PLL supply voltage

AVDD

1.3 V ± 50 mV

Processor bus supply voltage

BVSEL = 0

OVDD

1.8 V ± 5%

BVSEL = HRESET or OVDD

OVDD

2.5 V ± 5%

L3 bus supply voltage

L3VSEL = 0

GVDD

1.8 V ± 5%

L3VSEL = HRESET or GVDD

GVDD

2.5 V ± 5%

L3VSEL = ¬HRESET

GVDD

1.5 V ± 5%

Input voltage

Processor bus

Vin

GND

OVDD

L3 bus

Vin

GND

GVDD

JTAG signals

Vin

GND

OVDD

Die-junction temperature

0105

°C

Notes:

1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not

guaranteed.

2. This voltage is the input to the filter discussed in Section 9.2, “PLL Power Supply Filtering,” and not necessarily the voltage

at the AVDD pin, which may be reduced from VDD by the filter.

3. ¬HRESET is the inverse of HRESET.

Table 5. Package Thermal Characteristics 1

Characteristic

Symbol

Value

Unit

Notes

MPC7447

MPC7457

Junction-to-ambient thermal resistance, natural convection

RθJA

°C/W

2, 3

Junction-to-ambient thermal resistance, natural convection,

four-layer (2s2p) board

RθJMA

°C/W

2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow,

single-layer (1s) board

RθJMA

°C/W

2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow,

four-layer (2s2p) board

RθJMA

°C/W

2, 4

Junction-to-board thermal resistance

RθJB

°C/W

Junction-to-case thermal resistance

RθJC

<0.1

°C/W

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