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AS7221 データシート(PDF) 28 Page - ams AG |
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AS7221 データシート(HTML) 28 Page - ams AG |
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28 / 36 page ![]() Page 28 ams Datasheet Document Feedback [v1-01] 2016-Dec-08 AS7221 − Soldering & Storage Information Solder Reflow Profile The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 33: Recommended Reflow Soldering Profile Figure 34: Soldering Profile Graph Profile Feature Reference Device Average temperature gradient in preheating 2.5°C/s Soak Time tSOAK 2 to 3 minutes Time above 217°C (T1) t1 Max 60s Time above 230°C (T2) t2 Max 50s Time above Tpeak - 10°C (T3) t3 Max 10s Peak temperature in reflow Tpeak 260°C Temperature gradient in cooling Max - 5°C/s Soldering & Storage Information |
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