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STSPIN32F0 データシート(PDF) 36 Page - STMicroelectronics |
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STSPIN32F0 データシート(HTML) 36 Page - STMicroelectronics |
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36 / 40 page ![]() Package information STSPIN32F0 36/40 DocID029806 Rev 2 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. A customized VFQFPN48 7 x 7 package is proposed. A smaller EPAD, internally connected to the ground pin, is desired to place through holes on the bottom of the package. Lead plating is Nickel/Palladium/Gold (Ni/Pd/Au). |
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