604 Hardware Specifications

23

Preliminary/Subject to Change without Notice

Table 11 lists the mechanical dimensions values for the IBM C4-CQFP package.

Notes:

1. All dimensions and tolerances conform to ANSI Y14.5M–1982.

2. Controlling dimension—millimeter.

3. Datums – L –, –M –, and – N – to be determined at seating plane.

4. Dimensions S and V to be determined at seating plane – T–.

5. Dimensions A and B to outside of lead clip.

1.6.2 BGA Package Description

The following sections provide the package parameters and mechanical dimensions for the IBM and

Motorola BGA packages.

1.6.2.1 Package Parameters

The package parameters are as provided in the following list. The package type is 21 mm, 256-lead ceramic

ball grid array (BGA).

Package outline

21 mm

Interconnects

255

Pitch

1.27 mm

Maximum module height

3.16 mm

Table 11. Mechanical Dimensions Values

Dim

Millimeters

Min

Max

A

39.93

40.08

B

39.93

40.08

C

2.32

2.92

D

0.23

0.28

E

0.635 REF

G

0.5 BSC

J

0.12

0.20

K

0.40

0.60

S

42.4

42.8

V

42.4

42.8

W

0.35

—

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

AR

CH

IVE

D B

Y F

RE

ES

CA

LE

SE

MI

CO

ND

UC

TO

R,

INC

.