604 Hardware Specifications

27

Preliminary/Subject to Change without Notice

1.8 Thermal Management Information

This section provides thermal management information for the C4-CQFP and the BGA packages. Proper

thermal control design is primarily dependent upon the system-level design; that is, the heat sink, airflow

and the thermal interface material. Heat sinks are typically attached to a chip package by means of a spring

clip to holes in the printed-circuit board; see Figure 17.

Figure 17. C4-CQFP and BGA Exploded Cross-Sectional View with Heat Sink

The board designer can choose between several types of heat sinks to place on the 604. There are several

commercially-available heat sinks for the 604 provided by the following vendors:

Thermalloy

2021 W. Valley View Lane

214-243-4321

P.O. Box 810839

Dallas, TX 75731

International Electronic Research Corporation (IERC)

135 W. Magnolia Blvd.

Burbank, CA 91502

818-842-7277

Aavid Engineering

603-528-3400

One Kool Path

Laconic, NH 03247-0440

Wakefield Engineering

617-245-5900

60 Audubon Rd.

Wakefield, MA 01880

Ultimately, the final selection of an appropriate heat sink for the 604 depends on many factors, such as

thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.

Printed-Circuit Board

Heat Sink

Thermal Interface Material

Die

Heat Sink

Clip

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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