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PC7447AMGH1000LB データシート(PDF) 20 Page - ATMEL Corporation |
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PC7447AMGH1000LB データシート(HTML) 20 Page - ATMEL Corporation |
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20 / 44 page ![]() 20 5387B–HIREL–07/05 PC7447A [Preliminary] 7. Pin Assignment Figure 7-1 shows the pinout of the PC7447A, 360 high coefficient of the thermal expansion ceramic ball grid array (HITCE) package as viewed from the top surface. Figure 7-2 shows the side profile of the HITCE package to indicate the direction of the top surface view. Figure 7-1. Pinout of the PC7447A, 360 HITCE Package as Viewed from the Top Surface Figure 7-2. Side View of the CBGA Package A B C D E F G H J K L M N P R T 3 2 14 5 6 16 17 18 19 U V W 15 14 13 12 11 10 9 8 7 Substrate Assembly Encapsulant View Die |
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