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PC7447AMGH1000LB データシート(PDF) 37 Page - ATMEL Corporation

部品番号 PC7447AMGH1000LB
部品情報  PowerPC RISC microprocessor
PDF  44 Pages
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メーカー  ATMEL [ATMEL Corporation]
ホームページ  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

PC7447AMGH1000LB データシート(HTML) 37 Page - ATMEL Corporation

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37
5387B–HIREL–07/05
PC7447A [Preliminary]
13.2 PLL Power Supply Filtering
The AV
DD power signal is provided on the PC7447A to provide power to the clock generation
PLL. To ensure stability of the internal clock, the power supplied to the AV
DD input signal should
be filtered of any noise in the 500 KHz to 10 MHz resonant frequency range of the PLL. A circuit
similar to the one shown in Figure 13-1 using surface mount capacitors with minimum effective
series inductance (ESL) is recommended.
The circuit should be placed as close as possible to the AV
DD pin to minimize noise coupled from
nearby circuits. It is often possible to route directly from the capacitors to the AV
DD pin, which is
on the periphery of the 360 HITCE footprint.
Figure 13-1. PLL Power Supply Filter Circuit
13.3 Decoupling Recommendations
Due to the PC7447A dynamic power management feature, large address and data buses, and
high operating frequencies, the PC7447A can generate transient power surges and high fre-
quency noise in its power supply, especially while driving large capacitive loads. This noise must
be prevented from reaching other components in the PC7447A system, and the PC7447A itself
requires a clean, tightly regulated source of power. Therefore, it is recommended that the sys-
tem designer use sufficient decoupling capacitors, typically one capacitor for every 1-2 V
DD pins,
and a similar or lesser amount for the OV
DD pins, placed as close as possible to the power pins
of the PC7447A. It is also recommended that these decoupling capacitors receive their power
from separate V
DD, OVDD, and GND power planes in the PCB, utilizing short traces to minimize
inductance.
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic surface mount technology
(SMT) capacitors should be used to minimize lead inductance. Orientations where connections
are made along the length of the part, such as 0204, are preferable but not mandatory. Consis-
tent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A
Handbook of Black Magic (Prentice Hall, 1993) and contrary to previous recommendations for
decoupling Freescale microprocessors, multiple small capacitors of equal value are recom-
mended over using multiple values of capacitance.
In addition, it is recommended that there be several bulk storage capacitors distributed around
the PCB, feeding the V
DD and OVDD planes, to enable quick recharging of the smaller chip
capacitors. These bulk capacitors should have a low equivalent series resistance (ESR) rating to
ensure the quick response time necessary. They should also be connected to the power and
ground planes through two vias to minimize inductance. Suggested bulk capacitors are: 100-330
µF (AVX TPS tantalum or Sanyo OSCON).
13.4 Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropri-
ate signal level. Unless otherwise noted, unused active low inputs should be tied to OV
DD, and
unused active high inputs should be connected to GND. All NC (no connect) signals must
remain unconnected.
VDD
10
2.2
µF
2.2
µF
GND
AVDD
Low ESL surface mount capacitors



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