E2000 datasheet(93/104 Pages) INTEL

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Datasheet

Boxed Processor Specifications

The processor will also be offered as an Intel boxed processor. Intel boxed processors

are intended for system integrators who build systems from baseboards and standard

components. The boxed processor will be supplied with a cooling solution. This chapter

documents baseboard and system requirements for the cooling solution that will be

supplied with the boxed processor. This chapter is particularly important for OEMs that

manufacture baseboards for system integrators. Unless otherwise noted, all figures in

this chapter are dimensioned in millimeters and inches [in brackets]. Figure 23 shows a

mechanical representation of a boxed processor.

Note:

Drawings in this section reflect only the specifications on the Intel boxed processor

product. These dimensions should not be used as a generic keep-out zone for all

cooling solutions. It is the system designers’ responsibility to consider their proprietary

cooling solution when designing to the required keep-out zone on their system

platforms and chassis. Refer to the appropriate Thermal and Mechanical Design

Guidelines (see Section 1.2) for further guidance. Contact your local Intel Sales

Representative for this document.

NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.

Figure 23.

Mechanical Representation of the Boxed Processor

E2000 データシート(PDF) 93 Page - Intel Corporation