MPC875 datasheet(71/84 Pages) FREESCALE

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MPC875/MPC870 Hardware Specifications, Rev. 3.0

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

Freescale Semiconductor

Mechanical Data and Ordering Information

16 Mechanical Data and Ordering Information

Table 35 identifies the packages and operating frequencies available for the MPC875/870.

16.1 Pin Assignments

Figure 68 shows the JEDEC pinout of the PBGA package as viewed from the top surface. For additional

information, see the MPC885 PowerQUICC Family User’s Manual.

NOTE

The pin numbering starts with B2 in order to conform to the JEDEC standard for

23-mm body size using a 16

× 16 array.

Table 35. Available MPC875/870 Packages/Frequencies

Package Type

Temperature (Tj) Frequency (MHz)

Order Number

Plastic ball grid array

ZT suffix — Leaded

VR suffix — Lead-Free are available as needed

0°C to 95°C

KMPC875ZT66

KMPC870ZT66

MPC875ZT66

MPC870ZT66

KMPC875ZT80

KMPC870ZT80

MPC875ZT80

MPC870ZT80

133

KMPC875ZT133

KMPC870ZT133

MPC875ZT133

MPC870ZT133

Plastic ball grid array

CZT suffix — Leaded

CVR suffix — Lead-Free are available as needed

-40°C to 100°C

KMPC875CZT66

KMPC870CZT66

MPC875CZT66

MPC870CZT66

133

KMPC875CZT133

KMPC870CZT133

MPC875CZT133

MPC870CZT133

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