LM2502

SNLS176L – JANUARY 2004 – REVISED MAY 2013

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Table 4. Slave Pinout - NFBGA Package (continued)

SLV

1

2

3

4

5

6

7

F

D10

D11

D12

MF0

PLLCON1

PD*

G

D13

D14

D15

A/D

PLLCON0

CLK

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

−0.3V to +4.0 V

−0.3V to +4.0 V

−0.3V to +4.0 V

LVCMOS Input/Output Voltage

MPL Input/Output Voltage

Junction Temperature

+150 °C

Storage Temperature

−65°C to +150 °C

Lead Temperature Soldering,

40 Seconds

+260 °C

ESD Ratings:

HBM, 1.5 k

Ω, 100pF

≥±2 kV

EIAJ, 0

Ω, 200 pF

≥±200 V

Maximum Package Power Dissipation

2.5 W

Capacity at 25°C

Derate NFBGA Package above 25°C

25 mW/°C

Theta JA

45 °C/W

1.39 W

Derate WQFN Package above 25°C

11 mW/°C

Theta JA

90 °C/W

(1)

“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply

that the device should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

NFBGA assumes 4 layer PCB, WQFN assumes 2 layer PCB for thermal calculations.

RECOMMENDED OPERATING CONDITIONS

Min

Typ

Max

Units

Supply Voltage

2.9

3.0

3.3

V

1.7

3.3

V

Clock Frequency

3.0

26

MHz

Ambient Temperature

−30

25

85

°C

6

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